PMMA sacrificial layer based reliable debonding of ultra-thin chips after lapping

Ultra-thin chips (UTCs) are needed to meet the performance and packaging related requirements of flexible electronics 3D integrated circuits (ICs). However, handling UTCs (<50 μm thick), particularly after thinning, is a challenging task as excessive mechanical stresses could lead cracking. Such damages be prevented by restricting acceptable levels. Herein, we present new reliable cost-effective method based on polymethylmethacrylate (PMMA) sacrificial layer (20 μm-thick). The PMMA results in 4 order magnitude lower stress and, result, removal or debonding (35 μm-thick) from glass substrate has been achieved. distinctive features presented high reliability cost-effectiveness (an cheaper) with respect conventional methods that use UV curable tapes. metal-oxide-semiconductor capacitors (MOSCAPs) devices were also obtained using this approach evaluated under different bending conditions. stable uniform (134 pF) observed conditions demonstrates technique useful for integration high-performance printed circuit boards various practical application.